Preface to the Series

The technical level and development scale of the integrated circuit （IC） industry is one of the important indicators to measure a country's industrial competitiveness and comprehensive national strength， and is the source of modern economic development. The application of IC has already become routine in various industries， such as military satellites， radar， civilian automotive electronics， smart equipment， and consumer electronics，ect. Atpresent， the IC industry has formed three major industrial chains of design， manufacturing and packaging testing， which have become the indispensable pillar in the IC industry.

IC packaging is an indispensable process in the IC industry， which is the bridge from chip to device and device to system. It is a key fundamental manufacturing part of the IC industry and a competitive commanding height for the core device manufacturing of the IC industry.

With the rapid development of IC technology， higher and higher requirements for miniaturization， multi-function， high reliability and low cost of electronic products are put forward. Facing this situation， the electronic packaging materials and technologies are undergoing rapid development， promoting lots of advanced packaging materials. Advanced electronic packaging materials and technologies are the core of IC packaging.

In order to promote the development of China's advanced electronic packaging industry and meet the urgent needs of researchers ranged from teaching and scientific study to engineering developing in the field of electronic packaging， the editorial committee has invited famous specialists to write the series on Advanced Electronic Packaging Technology and Key Materials in recent years （English version）. The Seriesincludes： “Advanced Polyimide Materials”， “LED Packaging Technologies”， “Freeform Optics for LED Packages and Applications”， “Thermal Management of IC/LED Packages and Applications”， “Modeling， Analysis， Design， and Tests for Electronics Packaging beyond Moore”，“Ultrasonic Technologies in Advanced Electronic Packaging”， “TSV（through-silicon via technology） Package” etc.

This series of books systematically describes the advanced electronic packaging from three aspects： advanced packaging materials， advanced packaging technologies and advanced packaging simulation design methods. This series covers the most advanced packaging materials such as polyimide materials and packaging technologies such as freeform optical technology， ultrasonic technology， TSV（through-silicon via technology） packaging， and advanced packaging simulation design methods such as heat management， reliability design and multi-physics analysis and applications. In addition， this series also makes a planning outlook and forecast for the development trend of advanced electronic packaging.

This series of books is of great worth for workers engaged in scientific research， production and application in electronic packaging and related industries， and also has great reference significance to teachers and students of related majors in higher education institutions.

We believe that the publication of this series of books will play a positive role in promoting the development of China’s IC industry and advanced electronic packaging industry.

Finally， we would like to express our sincere gratitude to our colleagues who have worked hard in the preparation of this book. We also express our heartfelt thanks to those who participated in organizing the publication of this Series！

C.P. Wong

IEEE Fellow

Member of Academy of Engineering of the USA

Member of Chinese Academy of Engineering

Former Bell Labs Fellow

Dean of Engineering，The Chinese University of Hong Kong

Regents’ Professor， Georgia Institute of Technology， Atlanta， GA 30332，USA

Sheng Liu， Ph.D.

IEEE Fellow， ASME Fellow

ChangJiang Scholar Professor

Dean， School of Power and Mechanical Engineering，

Executive Director，Institute of Technological Sciences，

Wuhan University，

Wuhan， Hubei， China

Wenhui Zhu， Ph.D.

National Invited Professor

College of Mechanical and Electrical Engineering，

Central South University

Changsha， Hunan， China